In the SMT environment, the printed circuit board assembly process includes five operations in all. First, a solder paste is applied where the components will be placed. This is usually done by screen printing. Next, there is a placement operation in which a very high speed placement tool is used to mount tiny discrete components like resistors on the printed circuit board. Next, a flexible placement machine is used for mounting large components like integrated circuits on the printed circuit board. Once all the discrete devices have been placed, the board is checked for any missing components. Then, the printed circuit board is placed on a conveyor and baked in an oven, in order to make the solder paste reflow and form the solder joints. Finally, the printed circuit board has to be cleaned to get rid of contaminants revealed during the process of fabrication and assembly.
Monday, January 25, 2010
Monday, January 18, 2010
Circuit Board Design
Circuit Board Design | MakeMyCircuitBoard.com Today, electronic gadgets like computers, cell phones and multi-media players are ubiquitous. All of these electronic gadgets use one or more printed circuit boards inside them. Each printed circuit board contains multiple discrete devices properly placed on it and connected together to implement the correct functionality. The discrete components on these printed circuit boards can range from a few hundred to tens of thousands, all assembled on a single printed circuit board. The process of assembling a printed circuit board can be broadly classified into two types: Plated through Hole (PTH) Technology and Surface Mount Technology (SMT).
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